• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to an electronic device, in particular control unit, with cooling device. The electronic device is arranged in a housing (1) and comprises an electronic circuit arranged on a carrier plate (2). In order to provide advantageous construction conditions, it is proposed that on one side of the carrier plate (2) a spring carrier (3) with at least one plastic spring (4) which mechanically and thermally contacts the carrier plate (2) is arranged, that side surfaces of the spring carrier ( 3) have a sawtooth-shaped contour (5) that on the side facing away from the carrier plate of the spring carrier (3) has a spring tensioner (6) with side surfaces, the one to the sawtooth contour (5) of the side surfaces of the spring carrier a counterpart forming, sawtooth-shaped mating contour (7), is arranged, and that the carrier plate (2), the spring carrier (3) and the spring tensioner (6) are arranged on each other and in the housing, that the carrier plate (2), the spring carrier (3) and the Spring tensioner (6) against each other and against the housing (1) are braced.
    公开号:AT518126A1
    申请号:T51031/2015
    申请日:2015-12-01
    公开日:2017-07-15
    发明作者:Ganal Emmanuel；Hellinger Leopold；Neumann Gerhard；Neumann Philipp
    申请人:Melecs Ews Gmbh；
    IPC主号:
    专利说明:

    Electronic device with cooling device and an associated assembly method
    The invention relates to an electronic device with a cooling device, in particular a control device, which is arranged in a housing and comprises an electronic circuit arranged on a carrier plate.
    In particular, in vehicle electronics often results in the need to integrate electronic devices in a confined space and thereby perform variable electrical connections in terms of their orientation.
    In addition, a compact arrangement of electrical connections with respect to the requirements of electromagnetic compatibility, e.g. according to the European standard 61800-3, important. In this context, there is often the requirement to dispense with cables that require complex measures of shielding.
    Furthermore, the achievement of effective heat conduction is required due to high operating temperatures occurring.
    EP 2 429 273 A2 is known from the prior art, in which a cooling device for an electrical device and an associated manufacturing method is described. The electrical device comprises an electronic circuit arranged on a carrier plate and is arranged in a housing. The cooling device consists of cooling elements, which are arranged in the housing, the support plate and the housing mechanically and thermally contact and cause heat dissipation through the housing.
    The disadvantage of this arrangement results from the property that the housing is made in two parts and a first and a second housing part are connected to one another via screw connections. This results in a complex assembly process and a large number of individual parts.
    The invention is therefore based on the object of specifying an improved over the prior art electronic device.
    According to the invention this object is achieved with an electronic device of the type mentioned, in which on one side of the carrier plate, a spring carrier with at least one plastic spring, which contacts the carrier plate mechanically and thermally, is arranged at the side surfaces of the spring carrier a sawtooth
    Contour, in which on the side facing away from the carrier plate of the spring carrier, a spring tensioner with side surfaces having a sawtooth contour of the side surfaces of the spring carrier a counterpart sawtooth-shaped counter contour, is arranged, and in which the carrier plate, the spring carrier and the spring tensioner are arranged on each other and in the housing, that the support plate, the spring carrier and the spring tensioner against each other and against the housing are braced.
    The plastic spring gives the advantage of a device with two functions. First, the plastic spring provides thermal contact between the backing plate, the spring carrier, the spring tensioner, and the housing, and provides effective heat dissipation across the housing, allowing high operating temperatures to be achieved. Second, the spring force generated by the plastic spring results in a mechanical, non-positive retention of the arrangement of the carrier plate, the spring carrier and the spring compressor in the housing. It does not need its own component for the thermal contact and a separate component for the mechanical detention be used.
    The sawtooth contour of the spring carrier and the sawtooth-shaped counter contour of the spring compressor cause advantageously a kinematic relationship between the spring carrier and the spring tensioner, which generates an additional, transformed by 90 ° movement direction and the relative position between the spring carrier and the spring tensioner changed accordingly when on the spring carrier arranged spring compressor is inserted into the housing. This change in the relative position between the spring carrier and the spring compressor causes a compression of the plastic spring.
    The additional, transformed by 90 ° movement direction of the spring tensioner causes the compression of the plastic spring from a direction perpendicular to a longitudinal axis of the plastic spring, via a perpendicular to the lateral surface of the housing arranged housing opening, can be triggered.
    The tension of the carrier plate, the spring carrier and the spring compressor against each other and relative to the housing causes a mechanical holding the arrangement of the carrier plate, the spring carrier and the spring tensioner in the housing on the arrangement of the carrier plate, the spring carrier, the spring tensioner and the housing itself, without the need for separate fasteners must be used.
    It is favorable if a plug is connected to the carrier plate via contacting elements which are bent at an angle of 9-Θ-1.
    This measure brings about a compact arrangement of an electrical connection and it is possible to dispense with separate connecting elements such as cables. The property of angled contacting elements leads to an advantageous flexibility in the orientation of the plug, whereby an adaptation to limited space conditions is made possible.
    An advantageous embodiment results when a one tab, a contact pin and a Einzelleiterabdichtung comprehensive, guided through a hole in the housing ground contact element is arranged such that the
    Contact pin contacted a disposed on the mounting surface of the carrier plate spring contact.
    This measure results in a convenient connection of a mass in such a way that the ground contact element combines the functions of a ground contact, a seal and a fastener (on the tab) in it. About the bore of the contact pin is held in the correct position to the spring contact. The single conductor seal seals the bore.
    An advantageous solution is obtained when a mounted on the housing mounting bracket on a bottom has a recess in the shape of the tab of the ground contact element, in which the tab is arranged.
    By this measure, on the one hand the tab is held in the correct position and location and on the other hand, on the arrangement of the tab on the underside of the mounting bracket, a partial sheathing and thus protection of the ground contact element. It is advantageous if the ground contact element is caulked over the tab, on which mounting teeth are arranged along a circular path, with the mounting bracket.
    This measure results in an immediate and therefore advantageous connection between the ground contact element and the mounting bracket. It is achieved a compact arrangement and can be dispensed with separate fasteners.
    An advantageous solution is achieved when the spring tensioner is arranged on the spring carrier such that there is a fit between the sawtooth contour of the spring carrier and the sawtooth-shaped counter contour of the spring compressor when the carrier plate is inserted parallel to a base of the housing via a housing opening in the housing is until there is contact between the support plate and a housing rear wall, when the spring carrier is inserted with the spring compressor arranged parallel to a side surface of the housing via the housing opening in the housing until contact between the spring carrier and a housing rear wall, and when the spring compressor in parallel is pushed to a side surface of the housing further into the housing until contact between the spring compressor and a housing rear wall is made.
    This measure causes a tension of the support plate, the spring carrier and the spring vice against each other and with respect to the housing. It is advantageous that the process of bracing can be carried out solely by inserting the spring tensioner without having to use separate aids. This simplifies the assembly process.
    Furthermore, all operations of this measure via a perpendicular to the lateral surface of the housing arranged housing opening feasible, whereby no split housing must be used and therefore can be dispensed with connecting elements for the connection of housing parts. This reduces the complexity of the design by reducing the number of parts.
    The invention will be explained in more detail by means of exemplary embodiments.
    They show by way of example:
    1 is a perspective view of an inventive electronic device in a sectional view, wherein a housing, a support plate, a spring carrier, a spring tensioner and a plug are shown and the front of the electronic device is shown with the plug in the bottom right in the figure,
    2 shows an oblique view of an electronic device according to the invention in a sectional view, wherein a housing, a carrier plate, a spring carrier, a spring tensioner and a plug are shown and the rear side of the electronic device is shown on the bottom left in the figure,
    3 shows a perspective view of an electronic device according to the invention in a sectional view, wherein a housing, a carrier plate, a spring carrier, a spring tensioner and a plug are shown, the back of the electronic device is shown in the lower left in the figure and the arrangement of the spring compressor of the illustration in Fig. 2 differs
    4 shows a perspective view of an electronic device according to the invention in a sectional view, wherein a housing, a support plate, a spring carrier, a spring tensioner and a mounting bracket are shown and the back of the electronic device is shown in the bottom right of the figure, and
    5 shows a detailed representation of a ground contact element and a carrier plate, with a contact pin contacting a spring contact arranged on the carrier plate.
    Fig. 1, Fig. 2, Fig. 3 and Fig. 4 show an exemplary embodiment of an electronic device according to the invention, which is designed as a control unit. The electronic device has a cooling device via which heat is dissipated via a spring carrier 3, a spring tensioner 6 and a housing 1 by means of at least one plastic spring 4 contacting a mounting surface 15 of a carrier plate 2.
    The housing 1 has the shape of a cuboid with rounded edges.
    The carrier plate 2, the spring carrier 3 and the spring compressor 6 are arranged in the housing 1 such that the mounting surface 15 is aligned parallel to one of the larger side surfaces of the housing 1.
    The spring carrier 3 has the shape of a plate with angled side parts, which extend along the longest edge of the spring carrier 3 and have a sawtooth-shaped contour 5 in the region of the transition between the plate and the angled side parts.
    On the spring carrier 3, the plastic spring 4 is arranged. The Kunststoffeder 4 is cylindrical and one of its circular base surfaces is aligned parallel to the plate of the spring carrier 3 and connected to the plate of the spring carrier. The plastic spring 4 is arranged on that side of the spring carrier 3, on which the angled side parts are provided.
    The spring tensioner 6 has the shape of a plate with angled side parts, which extend along the longest edge of the spring compressor 6 and on the side facing away from the plate have a sawtooth-shaped counter contour 7.
    On one of the shorter sides of the support plate 2, a plug 8 is arranged. He has in this exemplary embodiment contacting elements 9, which are angled at 90 °. One end of a contacting element 9 contacts the mounting surface 15 of the support plate 2 and is aligned at right angles to this. Another end of the contacting element 9 is free and extends in a plane parallel to the mounting surface 15th
    Fig. 2 shows a mounting state in which the support plate 2, the spring carrier 3 and the spring tensioner 6 are inserted into the housing 1. The support plate 2 rests on one of the larger side surfaces of the housing 1 and adjoins a housing rear wall, which is aligned perpendicular to the lateral surface of the cuboid housing 1.
    The spring carrier 3 is arranged parallel to the support plate 2 such that the non-connected to the spring carrier 3 base surfaces of the plastic springs 4 contact the mounting surface 15 of the support plate 2. The spring carrier 3 is adjacent to the rear wall of the housing.
    The spring compressor 6 is arranged parallel to the spring carrier 3 such that there is a fit between the sawtooth-shaped mating contour 7 of the spring compressor 6 and the sawtooth-shaped contour 5 of the spring carrier 3.
    Fig. 3 also shows a mounting state in which the support plate 2, the spring carrier 3 and the spring tensioner 6 are inserted into the housing 1. The support plate 2 rests on one of the larger side surfaces of the housing 1 and adjoins a housing rear wall, which is aligned perpendicular to the lateral surface of the cuboid housing 1. The spring carrier 3 is arranged parallel to the support plate 2 such that the non-connected to the spring carrier 3 base surfaces of the plastic springs 4 contact the mounting surface 15 of the support plate 2. The spring carrier 3 is adjacent to the rear wall of the housing.
    The spring tensioner 6 is, compared with the state shown in Fig. 2, further inserted into the housing 1, so that it adjoins the rear wall of the housing.
    Between the sawtooth-shaped mating contour 7 of the spring compressor 6 and the sawtooth-shaped contour 5 of the spring carrier, there is no fit. The elevations of the sawtooth-shaped contour 5 contact the elevations of the sawtooth-shaped counter contour 7.
    This results in a contact of the spring compressor 6 with one of the larger side surfaces of the housing 1 and due to this contact is a compression of the plastic springs. 4
    As a result, the support plate 2, the spring carrier 3 and the spring compressor 6 against each other and against the housing ... braced.
    4 shows a mounting bracket 17 connected to the housing 1 with a cuboidal base plate 20 which extends in a plane parallel to one of the larger side surfaces of the housing 1 and with two prismatic side parts 21 with triangular base surfaces, which are connected to the base plate 20 of the mounting bracket 17 and with a, to the base plate 20 immediately adjacent, shorter side surface of the housing 1 are connected. On one, the side parts 21 facing away from the base plate is a recess 18 is formed, in which a tab 10 of a ground contact element 14 is arranged. The tab 10 of the mounting contact element 14 comprises an annular region on whose inner edge mounting teeth 19 are arranged. The mounting teeth 19 are caulked in the region of a cylindrical recess 22 with the base plate 20 of the mounting bracket 17.
    Fig. 5 shows a detailed view of the ground contact element 14. Perpendicular to the tab 10, a single conductor seal 12 and a contact pin 11 are arranged and connected to each other and to the tab 10. The Einzelleiterabdichtung 12 and the contact pin 11 are guided through a bore 13 in the housing 1, which extends perpendicular to the larger side surfaces of the housing in the housing 1. The Einzelleiterabdichtung 12 seals the interior of the housing 1 from the environment.
    The contact pin 11 contacts a spring contact 16, which is arranged on one of the longer sides of the mounting surface 15 of the support plate 2.
    List of designations 1 Housing 2 Carrier plate 3 Spring carrier 4 Plastic spring 5 Saw-toothed contour 6 Spring tensioner 7 Saw-toothed counter contour 8 Plug 9 Contact element 10 Tab 11 Contact pin 12 Single conductor seal 13 Bore 14 Ground contact element 15 Assembly surface 16 Spring contact 17 Mounting bracket 18 Recess 19 Mounting tooth 20 Base plate 21 Side section 22 Recess
    权利要求:
    Claims (6)
    [1]
    1. Electronic device with cooling device, in particular control unit, which is arranged in a housing (1) and one on a support plate (2) arranged electronic circuit, characterized in that on one side of the support plate (2) has a spring carrier (3) at least one plastic spring (4) which mechanically and thermally contacts the carrier plate (2), that side surfaces of the spring carrier (3) have a sawtooth-shaped contour (5) that on the side facing away from the carrier plate of the spring carrier (3) Spring tensioner (6) with side surfaces, which has a to the sawtooth contour (5) of the side surfaces of the spring support a counterpart sawtooth-shaped counter contour (7) is arranged, and that the support plate (2), the spring carrier (3) and the spring tensioner ( 6) are arranged on each other and in the housing, that the carrier plate (2), the spring carrier (3) and the spring tensioner (6) against each other so as compared to the housing (1) are braced.
    [2]
    2. Electronic device according to claim 1, characterized in that with the carrier plate (2) a plug (8) via angled contacting elements (9) is connected.
    [3]
    3. Electronic device according to claim 1, characterized in that a one tab (10), a contact pin (11) and a Einzelleiterabdichtung comprehensive (12), via a bore (13) in the housing (1) guided ground contact element (14) is arranged, that the contact pin (11) on the mounting surface (15) of the support plate (2) arranged spring contact (16) contacts.
    [4]
    4. An electronic device according to claim 3, characterized in that on the housing (1) arranged mounting bracket (17) on a bottom a recess (18) in the form of the tab (10) of the ground contact element (14), in which the Tab (10) is arranged.
    [5]
    5. Electronic device according to claim 4, characterized in that the ground contact element (14) via the tab (10) on which mounting teeth (19) are arranged along a circular path, with the mounting bracket (17) is caulked.
    [6]
    6. A method for mounting an electronic device according to any one of claims 1, 2, 3, 4 or 5, characterized in that the spring tensioner (6) on the spring carrier (3) is arranged such that between the sawtooth-shaped contour (5 ) of the spring carrier (3) and the sawtooth-shaped counter contour (7) of the spring tensioner results in a fit that the carrier plate (2) is inserted parallel to a side surface of the housing (1) via a housing opening in the housing (1), between the carrier plate (2) and a housing rear wall contact is that the spring carrier (3) with the spring compressor (6) arranged thereon is inserted parallel to a side surface of the housing (1) via a housing opening in the housing (1) until contact between the spring carrier ( 3) and a housing rear wall, and that the spring compressor (6) parallel to a side surface of the housing (1) further into the housing (1) is pushed into until contact between the spring compressor (6) and a rear housing wall consists.
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    同族专利:
    公开号 | 公开日
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    WO2017093112A1|2017-06-08|
    AT518126B1|2020-01-15|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US6049469A|1997-08-20|2000-04-11|Dell Usa, L.P.|Combination electromagnetic shield and heat spreader|
    US20060082975A1|2004-10-19|2006-04-20|Cinch Connectors, Inc.|Electronic control enclosure|
    EP2341535A1|2009-12-05|2011-07-06|SEMIKRON Elektronik GmbH & Co. KG|Pressure-contacted high performance semiconductor module with hybrid pressure accumulator|
    AT510389A2|2010-09-13|2012-03-15|Melecs Ews Gmbh & Co Kg|COOLING DEVICE FOR AN ELECTRICAL DEVICE AND ASSOCIATED METHOD OF MANUFACTURE|
    US20130258601A1|2012-03-28|2013-10-03|Foxconn Technology Co., Ltd.|Heat dissipation apparatus for electronic device|
    US3904933A|1974-10-23|1975-09-09|Control Data Corp|Cooling apparatus for electronic modules|
    GB2103020B|1981-07-30|1985-03-20|Marconi Avionics|Clamp arrangements for cooling electrical circuits|
    US8270172B2|2010-04-23|2012-09-18|GE Intelligent Platforms Embedded Systems, Inc.|Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system|AT520694B1|2017-11-29|2020-01-15|Melecs Ews Gmbh|Electronic device with cooling device and an associated assembly process|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA51031/2015A|AT518126B1|2015-12-01|2015-12-01|Electronic device with cooling device and an associated assembly process|ATA51031/2015A| AT518126B1|2015-12-01|2015-12-01|Electronic device with cooling device and an associated assembly process|
    EP16805040.9A| EP3345467B1|2015-12-01|2016-11-24|Electronic device having a cooling apparatus, and an associated assembly method|
    PCT/EP2016/078661| WO2017093112A1|2015-12-01|2016-11-24|Electronic device having a cooling apparatus, and an associated assembly method|
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